A chemical gold plating solution

Application number 201610072064. 1

Application date 2016. 02. 01

Applicant Harbin Institute of Technology (Weihai)

Address 264200 No. 2 Wenhua West Road, Gao District, Weihai City, Shandong Province

Inventor Liu Haiping, Bi Sifu, Wang Chunyu, Cao Lixin, Wang Yao

Patent agency Weihai Kexing Patent Office 37202

Name of invention

A electroless plating gold solution

Summary

The present invention relates to an electroless gold plating solution for rapidly depositing gold layers, which includes the following components: sodium gold sulfite (calculated as Au) 0.5-3g/L, sodium sulfite 22-28g/L, thiosulfuric acid Sodium 13-20g/L, triammonium citrate 1-5g/L; borax 8-12g/L, thiourea 0.1-5g/L; benzotriazole 0.01-0. 09g/L. The suitable pH value of the plating solution is 6.5-7.2, and the suitable temperature is 75-85°C. The gold plating solution provided by the present invention is cyanide-free, has good stability of the plating solution, and has a fast plating speed. The plating thickness can be more than 0.4 mm in 20 minutes. The plating layer has a golden appearance and bright color, which meets the requirements for thick gold plating of most products. It can not only meet the requirements of functional electronic electroplating, but also can be used as a decorative gold plating solution.
A chemical plating 液.pdf