An electroplating engineering plastic with high bonding force

Application number 201610158473. 3

Application date 2016.03.21

Applicant Suzhou Jinteng Electronic Technology Co., Ltd.

Address 215011, No.158, Huashan Road, High-tech Industrial Development Zone, Suzhou City, Jiangsu Province

Inventor Sun Zhengliang

Patent agency Nanjing Zhenglian Intellectual Property Agency Co., Ltd.

Agent Gu Boxing

Name of invention

An electroplating engineering plastic with high bonding force

Summary

The present invention discloses an electroplating engineering plastic with high binding force, including the following components: polycarbonate resin; polystyrene resin; erucamide; MPI resin; polyolefin elastomer; calcium stearate Coupling agent; 8 parts of conductive filler; compatibilizer and auxiliary agent. The present invention provides an electroplating engineering plastic, which can improve its hydrophilic properties and adhesion to the coating, and the prepared product has good electrical properties, mechanical properties, high temperature resistance, etc., and has excellent comprehensive properties.

A kind with high Cohesive electroplating engineering plastics (1).pdf