Cyanide-free alkaline copper plating electroplating solution and electroplating process

Application number 201610132947. 7

Application date 2016.03.09

Applicant Chongqing Lidao Surface Technology Co., Ltd. Address 402284 Degan Industrial Park, Jiangjin District, Chongqing City

Inventor Hu Guohui Wang Dongfeng Liu Jun Xiao Chunyan Bao Haisheng Tao Xiongxin

Patent agency Beijing Dongfang Shengfan Intellectual Property Agency

Name of invention

A cyanide-free alkaline copper plating electroplating solution and electroplating process

Summary

A cyanide-free alkaline copper plating bath and electroplating process belong to the environmental protection high-performance copper plating process. The process flow is: fine polishing and polishing-chemical degreasing-electric degreasing-pickling activation-forging. The copper plating layer obtained by this process is better than the cyanide copper plating process in depth ability and throwing ability under the premise of ensuring good adhesion between the plating layer and the substrate, and the porosity and toughness of the plating layer can reach the level of cyanide plating. Copper technology level, the copper plating solution and copper plating process are not only suitable for copper plating on steel and copper substrates, but also for direct copper plating on aluminum alloy and zinc alloy die casting substrates. At the same time, the copper electroplating solution has good stability, high current efficiency, simple wastewater treatment, uniform, dense, soft, and bright coating, non-hydrophobic, no film removal, and can be directly used for subsequent electroplating of other metals.

A non-cyanide Alkaline copper plating bath and electroplating process.pdf